Active thermal management layer deployed between high-density chips and standard heat sinks. Eliminate thermal throttling, even under 100% sustained load. Maintain stabilized temperature without the complex infrastructure of direct-to-chip liquid loops.
PROTOTYPE DEPLOYMENT READY
Liquid Cooling Performance
Air Cooling Convenience
The Thermal Problem: Moving Hotspots
Moving hot spots on Intel®️ Xeon®️ E5-2696v4 CPU
- warningIncreasing transistor density and fluctuating Al workloads cause thermal burst and moving hot spots on chip surfaces.
- warningThese lead to throttling, reduced reliability, and wasted energy.